Integrated air-spring for hydraulic force damping of a rigid liquid cooling subsystem

ABSTRACT

A direct-interface liquid-cooled (DL) Rack Information Handling System (RIHS) includes liquid cooled (LC) nodes that include a system of conduits supplying cooling liquid through the node enclosure and including a supply conduit extending from a node inlet coupling and a return conduit terminating in a node outlet coupling. The node inlet port and the node outlet port are positioned in an outward facing direction at a rear of the node enclosure and aligned to releasably seal to the respective inlet liquid port and outlet liquid port in the node-receiving slot for fluid transfer through the system of conduits. An air-spring reducer conduit is in fluid communication with the system of conduits and shaped to trap an amount of compressible fluid that compresses during sealing engagement between the node inlet coupling and node outlet coupling and the inlet liquid port and outlet liquid port, respectively.

RELATED APPLICATIONS

The present invention is a continuation of U.S. application Ser. No.15/017,582 filed Feb. 5, 2016 which claims priority from each of thefollowing provisional patent applications: Provisional Application Ser.No. 62/270,563, filed Dec. 21, 2015; and Provisional Application Ser.No. 62/270,580, filed Dec. 21, 2015. The contents of the above-listedapplications are incorporated herein by reference.

BACKGROUND 1. Technical Field

The present disclosure generally relates to information handling systems(IHS), and more particular to a direct-interface liquid cooled (DL)rack-configured IHS (RIHS), having a liquid cooling subsystem andliquid-cooled nodes. Still more particularly, the disclosure is relatedto insertion of nodes into the RIHS.

2. Description of the Related Art

As the value and use of information continue to increase, individualsand businesses seek additional ways to process and store information.One option available to users is Information Handling Systems (IHSs). AnIHS generally processes, compiles, stores, and/or communicatesinformation or data for business, personal, or other purposes, therebyallowing users to take advantage of the value of the information.Because technology and information handling needs and requirements varybetween different users or applications, IHSs may also vary regardingwhat information is handled, how the information is handled, how muchinformation is processed, stored, or communicated, and how quickly andefficiently the information may be processed, stored, or communicated.The variations in IHSs allow for IHSs to be general or configured for aspecific user or specific use such as financial transaction processing,airline reservations, enterprise data storage, or global communications.In addition, IHSs may include a variety of hardware and softwarecomponents that may be configured to process, store, and communicateinformation and may include one or more computer systems, data storagesystems, and networking systems.

For implementations requiring a large amount of processing capability, arack-configured (or rack) IHS (RIHS) can be provided. The RIHS includesa physical rack, within which is inserted a plurality of functionalnodes, such as server (or processing) nodes/modules, storage nodes, andpower supply nodes. These nodes, and particularly the server nodes,typically include processors and other functional components thatdissipate heat when operating and/or when connected to a power supply.Efficient removal of the heat being generated by these components isrequired to maintain the operational integrity of the RIHS. Traditionalheat removal systems include use of air movers, such as fans, toconvectionally transfer the heat from inside of the RIHS to outside theRIHS. More recently, some RIHS have been designed to enable submersionof the server modules and/or the heat generating components in a tank ofcooling liquid to effect cooling via absorption of the heat by thesurrounding immersion liquid.

The amount of processing capacity and storage capacity per node and/orper rack continues to increase, providing greater heat dissipation pernode and requiring more directed cooling solutions. Thus, there is acontinuing need for further innovations to provide directed cooling forthe individual heat generating components, both at the individual nodelevel, as well as at the larger rack level. When designing the coolingsubsystem, consideration must also be given to the different formfactors of IT nodes and rack heights of the RIHS, and the ability toeffectively control cooling discretely (at device or node level) andgenerally across the overall RIHS.

As liquid cooling improves in efficiencies and performance, data centersolutions continue to focus on implementing liquid cooling at the racklevel. Recently, localized liquid solutions (CPU/GPU cold plates) havebeen successful in removing most of the heat from these componentswithin a server and into the facility cooling loop through directfluid-to-fluid heat exchangers (server cooling loop to facility coolingloop) within the rack, but this method does not provide cooling toauxiliary components (such as storage devices (HDDs, memory), orcritical secondary IT equipment, such as top of the rack switch, networkswitches, battery backup units, or Power Supply Units (PSUs).

To increase system availability, RIHS maintenance and upgrades caninclude hot plugging nodes into a block chassis with other nodescontinuing to operate. In a liquid cooled RIHS, insertion of the nodeentails more than mechanical engagement and electrical quick connects.The newly inserted liquid cooled node can require hookup to a supply andreturn of cooling liquid. Supply pressures of around 80 psi can presentlarge mechanical forces at a fluid interconnect.

BRIEF SUMMARY

The illustrative embodiments of the present disclosure provides aDirect-Interface Liquid-Cooled (DL) Rack Information Handling System(RIHS), a direct-interface liquid cooling subsystem, and a method formodularly providing liquid cooling to information technology (IT) nodeswithin a RIHS, where the nodes are liquid cooled (LC) nodes that containheat-generating functional components. To reduce insertion forces LCnodes at pressurized liquid quick connections, conduits within LC nodesinclude a compressible fluid in addition to the incompressible fluid ofliquid cooling system. An air spring is formed by a trapped gas bubblesuch as air in dead-end shunt conduit that communicates with a supplyconduit. The trapped gas bubble can compress and expand to mitigate anabrupt pressure change during insertion of the LC node, thereby reducingthe force required to make a quick connection with the liquid coolingsubsystem.

According to one aspect, the an RIHS includes a rack having one or morenode-receiving slots each slot having a front opening for node insertionand a rear section opposed to the front access. A node-receiving liquidinlet port and a node-receiving liquid outlet port are located at therear section of one node-receiving slot. The node-receiving liquid inletport and a node-receiving liquid outlet port are positioned to beinwardly facing for blind mating to a node inlet and outlet ports of aliquid-cooled (LC) node inserted in the one node-receiving slot. An LCnode is insertably received in the one node-receiving slot and includesa node enclosure containing heat-generating functional components. LCnodes includes a system of conduits supplying cooling liquid through thenode enclosure and including a supply conduit extending from a nodeinlet coupling and a return conduit terminating in a node outletcoupling. The node inlet port and the node outlet port are positioned inan outward facing direction at a rear of the node enclosure. The nodeinlet port and the node outlet port are aligned to releasably seal tothe respective inlet liquid port and outlet liquid port in thenode-receiving slot, for fluid transfer through the system of conduits.An air-spring reducer conduit is in fluid communication with the systemof conduits. The air-spring reducer conduit is shaped to trap an amountof compressible fluid that compresses during sealing engagement betweenthe node inlet coupling and node outlet coupling and the inlet liquidport and outlet liquid port, respectively.

In one aspect, a method of assembling an RIHS includes provisioning anode enclosure with heat-generating functional components. The methodincludes assembling with a system of conduits in fluid communication anair-spring reducer conduit. The air-spring reducer conduit is shaped totrap an amount of compressible fluid that compresses during sealingengagement between a node inlet coupling and a node outlet coupling andan inlet liquid port and an outlet liquid port, respectively. The methodincludes attaching the system of conduits supplying cooling liquidthrough the node enclosure. The system of conduits includes a supplyconduit extending from the node inlet coupling and a return conduitterminating in the node outlet coupling. The node inlet port and thenode outlet port positioned in an outward facing direction at a rear ofthe node enclosure and aligned to releasably seal to the respectiveinlet liquid port and outlet liquid port in the node-receiving slot, forfluid transfer through the system of conduits to form a liquid-cooled(LC) node. The method includes mounting the LC node insertably receivedin the one node-receiving slot of a rack having one or morenode-receiving slots. Each slot has a front opening for node insertionand a rear section opposed to the front access for blind mating of thenode inlet and outlet ports to a node-receiving liquid inlet port and anode-receiving liquid outlet port located at the rear section of onenode-receiving slot. The node-receiving inlet and outlet ports arepositioned to be inwardly facing to the LC node inserted in the onenode-receiving slot.

The above presents a general summary of several aspects of thedisclosure in order to provide a basic understanding of at least someaspects of the disclosure. The above summary contains simplifications,generalizations and omissions of detail and is not intended as acomprehensive description of the claimed subject matter but, rather, isintended to provide a brief overview of some of the functionalityassociated therewith. The summary is not intended to delineate the scopeof the claims, and the summary merely presents some concepts of thedisclosure in a general form as a prelude to the more detaileddescription that follows. Other systems, methods, functionality,features and advantages of the claimed subject matter will be or willbecome apparent to one with skill in the art upon examination of thefollowing figures and detailed written description.

BRIEF DESCRIPTION OF THE DRAWINGS

The description of the illustrative embodiments can be read inconjunction with the accompanying figures. It will be appreciated thatfor simplicity and clarity of illustration, elements illustrated in thefigures have not necessarily been drawn to scale. For example, thedimensions of some of the elements are exaggerated relative to otherelements. Embodiments incorporating teachings of the present disclosureare shown and described with respect to the figures presented herein, inwhich:

FIG. 1 illustrates a side perspective view of an internallayout/configuration of an example Direct-Interface Liquid-Cooled (DL)RIHS, according to one or more embodiments;

FIG. 2 illustrates a detailed block diagram of a DL RIHS configured withLC nodes arranged in blocks and which are cooled in part by a liquidcooling subsystem having a rail comprised of MLD conduits, and in partby a subsystem of air-liquid heat exchangers, according to multipleembodiments;

FIG. 3 illustrates an expanded, more detailed view of the liquidinterconnection between the node level heat exchange manifold, the blockliquid manifold containing the air-liquid heat exchanger, and exampleMLDs of the liquid rail, according to multiple embodiments;

FIG. 4 illustrates a front perspective view of an example DL RIHS withfront removable nodes, according to one or more embodiments;

FIG. 5 illustrates a rear perspective view of the example DL RIHS ofFIG. 4 with a louvered rear door in a closed position over uncovered MLDconduits, according to one or more embodiments;

FIG. 6 illustrates a rear perspective view of the example DL RIHS ofFIG. 4 with the louvered rear door opened to expose node-to-nodeinterconnection of MLD conduits of different vertical sizes havingappropriately sized and removable pipe covers, according to one or moreembodiments;

FIG. 7 illustrates the rear perspective view of FIGS. 5-6 with the pipecovers removed to expose the MLD conduits, according to one or moreembodiments;

FIG. 8 illustrates a side view of an example LC node configured with aliquid cooling subsystem that includes a liquid-to-liquid manifold andcooling pipes for conductively cooling internal functional components,according to one or more embodiments;

FIG. 9 illustrates a front perspective view of a system of conduits ofthe example LC node of FIG. 8 including a P-trap air-spring reducerconduit, according to one or more embodiments;

FIG. 10 illustrates a side perspective view of a system of conduits ofthe example LC node of FIG. 8 including a P-trap air-spring reducerconduit, according to one or more embodiments;

FIG. 11 illustrates a side perspective detail view of a system ofconduits of the example LC node of FIG. 8 including a P-trap air-springreducer conduit, according to one or more embodiments;

FIG. 12 illustrates a front perspective view of the P-trap air springreducer conduit of FIG. 8 that has a dog-leg shape, according to one ormore embodiments;

FIG. 13 illustrates a side perspective view of the P-trap air-springreducer conduit of FIG. 12, according to one or more embodiments;

FIG. 14 illustrates a side perspective view of an example air springreducer conduit having an arched, hooked shape, according to one or moreembodiments; and

FIG. 15 illustrates a flow diagram of a method of assembling a DL RIHShaving an air-spring reducer conduit, according to one or moreembodiments.

DETAILED DESCRIPTION

The present disclosure generally provides a Direct-InterfaceLiquid-Cooled (DL) Rack Information Handling System (RIHS) providingliquid cooled (LC) information technology (IT) nodes containingheat-generating functional components and which are cooled at least inpart by a liquid cooling subsystem. The RIHS includes a rack configuredwith chassis-receiving bays in which is received a respective chassis ofone of the LC nodes. Each LC node is configured with a system ofconduits to receive direct intake/flow of cooling liquid to regulate theambient temperature of the node. Additionally, each LC node, configuredwith a system of conduits, provides cooling to the components inside thenode by conductively absorbing, via the cooling liquid, heat generatedby the heat-generating functional components. The absorbed heat isremoved (or transferred away) from within the node to outside of thenode and/or the RIHS.

As data center cooling technologies continues their path toward the mostenergy efficient solution, liquid cooling is becoming a primary methodfor heat rejection. As such, quick connection systems are becoming thenorm to enable blind mate instillation of liquid cooled IT equipment inan IT rack while maintaining the integrity of the liquid network. Whilequick connections provide a unique method for hardwareinsertion/removal, the incompressibility of the operating fluid createschallenges. Facility operating pressures, which can exceed 60 psi, canpressurize the quick connect ports, and pose an extreme challenge toreinsert the quick connect. The user is then required to overcome thesystem static pressure, as well as the pressure caused by the travel ofthe quick connections which can cause insertion force requirements thatmay pose difficulty to a user. A solution is needed to mitigate theadditional insertion force due to the quick connection travel and theincompressibility of the operating fluid.

A fluid network with a unique P-trap/Air Spring Reducer maintains acompressible fluid within the incompressible fluid network. Air-springreducer conduit is tunable based upon the volume of air in the geometry.A larger diameter or longer length of pipe can be selected to providefor more compressibility. Air follows the ideal gas law where P isdirectly related to density of air under compression. For system leaktesting, a valve/connection may be added to top of the P trap toincrease system pressure for validation testing without inducing airinto the fluid network. The air-spring reducer conduit can be locatedbetween a quick connection on the exterior of a node enclosure and thenext component of the fluid network. The geometry can be orientated suchthat the liquid fluid level contains an air pocket at the end of thedevice. Air will be at the highest location of the local fluid network.In the following detailed description of exemplary embodiments of thedisclosure, specific exemplary embodiments in which the disclosure maybe practiced are described in sufficient detail to enable those skilledin the art to practice the disclosed embodiments. For example, specificdetails such as specific method orders, structures, elements, andconnections have been presented herein. However, it is to be understoodthat the specific details presented need not be utilized to practiceembodiments of the present disclosure. It is also to be understood thatother embodiments may be utilized and that logical, architectural,programmatic, mechanical, electrical and other changes may be madewithout departing from general scope of the disclosure. The followingdetailed description is, therefore, not to be taken in a limiting sense,and the scope of the present disclosure is defined by the appendedclaims and equivalents thereof.

References within the specification to “one embodiment,” “anembodiment,” “embodiments”, or “one or more embodiments” are intended toindicate that a particular feature, structure, or characteristicdescribed in connection with the embodiment is included in at least oneembodiment of the present disclosure. The appearance of such phrases invarious places within the specification are not necessarily allreferring to the same embodiment, nor are separate or alternativeembodiments mutually exclusive of other embodiments. Further, variousfeatures are described which may be exhibited by some embodiments andnot by others. Similarly, various requirements are described which maybe requirements for some embodiments but not other embodiments.

It is understood that the use of specific component, device and/orparameter names and/or corresponding acronyms thereof, such as those ofthe executing utility, logic, and/or firmware described herein, are forexample only and not meant to imply any limitations on the describedembodiments. The embodiments may thus be described with differentnomenclature and/or terminology utilized to describe the components,devices, parameters, methods and/or functions herein, withoutlimitation. References to any specific protocol or proprietary name indescribing one or more elements, features or concepts of the embodimentsare provided solely as examples of one implementation, and suchreferences do not limit the extension of the claimed embodiments toembodiments in which different element, feature, protocol, or conceptnames are utilized. Thus, each term utilized herein is to be given itsbroadest interpretation given the context in which that terms isutilized.

As utilized herein, the term “rack-configured” (as in RIHS) generallyrefers to the configuration of a large scale sever system within aphysical rack having multiple chassis receiving rails for receivingspecific sizes of information technology (IT) nodes, such as servermodules, storage modules, and power modules. The term node generallyrefers to each separate unit inserted into a 1 U or other height rackspace within the rack. In one embodiment, operational characteristics ofthe various IT nodes can be collectively controlled by a singlerack-level controller. However, in the illustrated embodiments, multiplenodes can be arranged into blocks, with each block having a separateblock-level controller that is communicatively connected to therack-level controller.

For purposes of this disclosure, an information handling system (definedat the individual server level) may include any instrumentality oraggregate of instrumentalities operable to compute, classify, process,transmit, receive, retrieve, originate, switch, store, display,manifest, detect, record, reproduce, handle, or utilize any form ofinformation, intelligence, or data for business, scientific, control, orother purposes. For example, an information handling system may be apersonal computer, a network storage device, or any other suitabledevice and may vary in size, shape, performance, functionality, andprice. The information handling system may include random access memory(RAM), one or more processing resources such as a central processingunit (CPU) or hardware or software control logic, ROM, and/or othertypes of nonvolatile memory. Additional components of the informationhandling system may include one or more disk drives, one or more networkports for communication with external devices as well as various inputand output (I/O) devices, such as a keyboard, a mouse, and a videodisplay. The information handling system may also include one or morebuses operable to transmit communications between the various hardwarecomponents.

As illustrated by the figures and described herein, multiple processingservers or server IHSs (referred to herein as server nodes) can beincluded within the single RIHS. Certain aspect of the disclosure thenrelate to the specific LC (sever or other) nodes and the functionalityassociated with these individual nodes or block-level groupings ofnodes, while other aspects more generally relate to the overall DL RIHScontaining all of the LC nodes.

As one design detail/aspect for the present innovation, consideration isgiven to the fact that extreme variations can exist inserver/power/network topology configurations within an IT rack. Inaddition to dimension variations, the thermal requirements forheat-generating functional components for power, control, storage andserver nodes can be very different between types or vary according tousage. These variations drive corresponding extreme diversity in portplacement, fitting size requirements, mounting locations, and manifoldcapacity for a liquid cooling subsystem. Further, a chassis of each nodeis typically densely provisioned. Lack of space thus exists to mount adiscrete water distribution manifold in high-power IT racks. The presentdisclosure addresses and overcomes the challenges with distributingliquid cooling fluids throughout an IT rack having nodes with a largenumber of variations in distribution components.

The disclosure also includes the additional consideration that inaddition to cooling the primary heat generating components of the rack,such as the processor, what is needed is a way to allow for cooling ofsecondary equipment within the rack, as well as auxiliary componentsthat would further support utilizing the advantages of a fluid-to-fluidheat exchanger methodology. Additionally, the present disclosureprovides a modular approach to utilizing an air-to-liquid heat exchangerwith quick connection and scalability to allow the solution to bescalable in both 1 U and 2 U increments.

FIG. 1 illustrates a side perspective view of an internallayout/configuration of an example DL RIHS 100 configured with aplurality of LC nodes 102, according to one or more embodiments. Forsimplicity, the example DL RIHS presented in the various illustrationscan be described herein as simply RIHS 100; however, references to RIHS100 are understood to refer to a DL RIHS, with the associated liquidcooling infrastructure and/or subsystems and supported LC nodes 102.RIHS 100 includes rack 104, which comprises a rack frame and sidepanels, creating a front-to-back cabinet within which a plurality ofchassis receiving bays are vertically arranged and in which a chassis ofa respective IT node 102 can be inserted. Rack 104 includes certainphysical support structures (not specifically shown) that support ITgear insertion at each node location. Additional description of thestructural make-up of an example rack is provided in the description ofFIGS. 2-4, which follows.

FIG. 1 depicts an illustrative example of LC nodes 102 a-102 j(collectively refer to as nodes 102), with each nodes 102 a-102 iincluding heat-generating functional components 106. Additionally, RIHS100 also includes an infrastructure node 102 j and liquid filtrationnode 102 k, which do not necessarily include heat-generating functionalcomponents 106 that require liquid cooling, as the other LC nodes 102a-102 i. In the illustrative embodiments, nodes 102 a-102 b, and 102e-102 h include other components 108 that are not necessarily heatgenerating, but which are exposed to the same ambient heat conditions asthe heat generating components by virtue of their location within thenode. In one embodiment, these other components 108 can be sufficientlycooled by the direct-intake/flow of cooling liquid applied to the nodeand/or using forced or convective air movement, as described laterherein. Each node 102 is supported and protected by a respective nodeenclosure 107. Nodes 102 a-102 d are further received in node receivingbays 109 of a first block chassis 110 a of a first block 112 a. Nodes102 e-102 i are received in a second block chassis 110 b of a secondblock 112 b. In the illustrative embodiments, the nodes 102 arevertically arranged. In one or more alternate embodiments, at leastportions of the nodes 102 (and potentially all of the nodes) may also bearranged horizontally while benefitting from aspects of the presentinnovation.

The present innovation is not limited to any specific number orconfiguration of nodes 102 or blocks 112 in a rack 104. According to oneaspect, nodes 102 can be of different physical heights of form factors(e.g., 1 U, 1.5 U, 2 U), and the described features can also be appliedto nodes 102 having different widths and depths (into the rack), withsome extensions made and/or lateral modifications to the placement ofcooling subsystem conduits, as needed to accommodate the differentphysical dimensions. As a specific example, node 102 i is depicted ashaving a larger node enclosure 107′ (with corresponding differentdimensions of heat-generating functional components 106′) of a differentnumber of rack units in physical height (e.g., 2 U) that differs fromthe heights (e.g., 1 U) of the other nodes 102 a-102 h and 102 j-102 k.RIHS 100 can include blocks 112 or nodes 102 selectably of a range ofdiscrete rack units. Also, different types of IT components can beprovided within each node 102, with each node possibly performingdifferent functions within RIHS 100. Thus, for example, a given node 102may include one of a server module, a power module, a control module, ora storage module. In a simplest configuration, the nodes 102 can beindividual nodes operating independent of each other, with the RIHS 100including at least one rack-level controller (RC) 116 for controllingoperational conditions within the RIHS 100, such as temperature, powerconsumption, communication, and the like. Each node 102 is then equippedwith a node-level controller (NC) 118 that communicates with therack-level controller 116 to provide localized control of theoperational conditions of the node 102. In the more standardconfiguration of a DL RIHS 100, and in line with the describedembodiments, RIHS 100 also includes block-level controllers (BCs) 114,communicatively coupled to the rack-level controller 116 and performingblock-level control functions for the LC nodes within the specificblock. In this configuration, the nodes 102 are arranged into blocks112, with each block 112 having one or more nodes 102 and acorresponding block-level controller 114. Note the blocks do notnecessarily include the same number of nodes, and a block can include asingle node, in some implementations.

A DL subsystem (generally shown as being within the RIHS and labelledherein as 120) provides direct-intake/flow of cooling liquid toheat-generating functional components 106 via a liquid rail 124 underthe control of the rack-level controller 116, block-level controllers114, and/or node-level controllers 118, in some embodiments. Rack-levelcontroller 116 controls a supply valve 126, such as a solenoid valve, toallow cooling liquid, such as water, to be received from a facilitysupply 128. The cooling liquid is received from facility supply 128 andis passed through liquid filtration node 102 l before being passedthrough supply conduit 130 of liquid rail 124. Each block 112 a, 112 breceives a dynamically controlled amount of the cooling liquid viablock-level dynamic control valve 132, such as a proportional valve.Return flow from each block 112 a, 112 b can be protected from backflowby block-level (or block) check valve 133. The individual needs of therespective nodes 102 a-102 d of block 112 a can be dynamically providedby respective node-level dynamic control valves 134, controlled by theblock-level controller 114, which control can, in some embodiments, befacilitated by the node-level controllers 118. In addition to allocatingcooling liquid in accordance with cooling requirements (which can beoptimized for considerations such as performance and economy), each ofthe supply valve 126 and/or dynamic control valves 132, 134 can beindividually closed to mitigate a leak. A check valve 136 is providedbetween each node 102 a-102 j and a return conduit 138 of the liquidrail 124 to prevent a backflow into the nodes 102 a-102 j. The returnconduit 138 returns the cooling liquid to a facility return 140.

To support the temperature control aspects of the overall system, RIHS100 includes temperature sensors 101 that are each located within orproximate to each node 102 a-102 j, with each temperature sensor 101connected to the node-level controller 118 and/or the correspondingblock-level controller 114. Temperature sensors 101 operate in afeedback control loop of the liquid cooling subsystem 122 to control theamount of liquid flow required to cool the nodes 102 a-102 j. In one ormore embodiments, the rack-level controller 116 can coordinateperformance constraints to block-level controllers 114 and/or node-levelcontrollers 118 that limit an amount of heat generated by theheat-generating functional components 106 to match a heat capacity ofthe flow of cooling liquid in DL subsystem 122. Alternatively or inaddition, the rack-level controller 116 can coordinate cooling levels toblock-level controllers 114 and/or node-level controllers 118 that inturn control the dynamic control valves 132, 134 for absorption andtransfer of the heat generated by the heat-generating functionalcomponents 106 by the DL subsystem 122. In one or more embodiments,support controllers such as a Rack Liquid Infrastructure Controller(RLIC) 142 can perform management and operational testing of DLsubsystem 122. RLIC 142 can monitor pressure sensors 144 and liquidsensors 146 to detect a leak, to validate operation of a dynamic controlvalves 132, 134 or shut-off valves such as supply valve 126. RLIC 142can perform close-loop control of specific flow rates within the RIHS100.

To provide for availability of service by the computing components ofthe RIHS, nodes 102 a-102 h can be hot pluggable. For example the nodeenclosure 107 can be inserted into the rack 104 with other nodes 102a-102 h continuing to be serviced by the DL subsystem 120. Providingsufficient fluid pressure through the DL subsystem for adequate coolingcapacity can create significant mechanical forces to achieve a good sealbetween quick coupling connectors. To mitigate peak forces, nodes 102a-102 h include an air-spring reducer conduit 103 that traps acompressible fluid such as air. Engagement forces transferred through anincompressible cooling liquid such as water can be dampened by theair-spring reducer conduit 103.

FIG. 2 illustrates a more detailed view of the interconnections of theliquid cooling subsystem, at a node level and rack level within anexample DL RIHS 200. As shown, RIHS 200 is configured with LC nodes 202a-202 e arranged in blocks (e.g., block 1 comprising 202 a-802 c) andwhich are cooled in part by a liquid cooling subsystem having a liquidrail comprised of MLD conduits, and in part by a subsystem of air-liquidheat exchangers, can be configured with heat-generating functionalcomponents 206 and that are cooled at least in part by a system of MLDconduits 278 a-278 b, according to one or more embodiments. Illustratedwithin nodes 202 are heat-generating functional components 206, such asprocessors, voltage regulators, etc., which emit heat during operationand or when power is applied to the component, such that the ambienttemperature increases around the component, and within the node, andeventually within the block, and ultimately DL RIHS 200, during standardoperation. To mitigate heat dissipation (and effects thereof), and tomaintain the RIHS, block, node, and functional components within properoperating temperatures, DL RIHS 200 is configured with DL subsystem 222.DL subsystem 222 includes a rack level network of liquid propagatingpipes, or conduits that are in fluid communication with individual nodelevel networks of liquid propagating conduits. Additionally, DLsubsystem 222 collectively facilitates heat absorption and removal atthe component level, the node level, the block level, and/or the racklevel. The rack-level network of conduits includes a modular arrangementof a liquid rail 224 formed by more than one node-to-node MLD conduit278 a-278 b spanning (or extending) between LC nodes 202 provisioned inrack 204.

At the top position of RIHS 200, a block chassis 210 is received in ablock chassis receiving bay 270 a of rack 204. Within block chassis 210,a first node 202 a received in a first node receiving bay 209 a of therack 204 has a vertical height of one rack unit (1 U). A rack unit, U orRU as a unit of measure, describes the height of electronic equipmentdesigned to mount in a 19-inch rack or a 13-inch rack. The 19 inches(482.60 mm) or 13 inches (584.20 mm) dimension reflects the horizontallateral width of the equipment mounting-frame in the rack including theframe; the width of the equipment that can be mounted inside the rack isless. According to current convention, one rack unit is 1.75 inches(44.45 mm) high. A second node 202 b received in a second node receivingbay 209 b of the rack 104 (of FIG. 1) has a vertical height of 1 U. Athird node 202 c received in a third node receiving bay 209 c of therack 204 has a vertical height of 1 U. A fourth node 202 d,infrastructure node 202 b, is received in a second block chassisreceiving bay 270 b of rack 204 and has a vertical height of 1 U.Infrastructure node 202 b can contain functional components such as arack-level controller 216. A fifth node 202 e is received in a thirdchassis receiving bay 270 c and has a vertical height of 2 U. A sixthnode 202 f, which provides a Rack Filtration Unit (RFU) 271, is receivedin a fourth block chassis receiving bay 270 d of the rack 204.Infrastructure node 202 and RFU 271 are examples of nodes 202 that maynot require liquid cooling. A cascading liquid containment structure 277is received in a fifth chassis receiving bay 270 e and includes liquidsensor 297.

MLD conduits 278 a of 1 U can be used to connect nodes of 1 U verticalspacing. Because of the additional 1 U separation of LC nodes 202 c and202 e by inclusion of infrastructure node 202 d, MLD conduit 278 bbetween the third and fifth nodes 202 c-202 d is dimension 2 U toaccommodate the increased spacing. MLD conduits 278 a-278 b can thussupport different heights (1 U to NU) of IT components.

Each MLD conduit 278 a-278 b includes first and second terminalconnections 283, 284 attached on opposite ends of central conduit 285that is rack-unit dimensioned to seal to a port of LC node 202 andenable fluid transfer between a port of a selected LC node 202 and aport of an adjacent LC node 202. In FIG. 2, facility supply 228 andfacility return 240 are respectively located at the intake end of liquidrail 224 and the exhaust end of liquid rail 224. The actual location offacility supply 228 and facility return 240 can be reversed.Alternatively, facility supply 228 and facility return 240 can belocated above the RIHS 200 or both conduits can be located on oppositesides of the RIHS 200 in alternate embodiments.

Liquid cooling subsystem 222 includes a liquid infrastructure managercontroller (LIMC) 286 which is communicatively coupled to block liquidcontrollers (BLCs) 287 to collectively control the amount of coolingliquid that flows through the RIHS 200 and ultimately through each ofthe nodes 202 in order to effect a desired amount of liquid cooling atthe component level, node level, block level, and rack level. Forclarity, LIMC 286 and BLCs 287 are depicted as separate components. Inone or more embodiments, the liquid control features of the LIMC 286 andBLCs 287 can be incorporated into one or more of the rack-levelcontroller 216, block-level controllers 220, and the node-levelcontrollers 218. As illustrated in FIG. 1 and previously described, eachof the LIMC 286 and BLCs 287 are connected to and respectively controlthe opening and closing of flow control valves that determine the amountof flow rate applied to each block and to each node within the specificblock. During cooling operations, one of LIMC 286 and BLC 287 causes aspecific amount of liquid to be directly injected into the intakeconduits of the LC node 202, which forces the cooling liquid through thesystem of conduits within the LC node 202 to the relevant areas and/orfunctional components/devices inside the nodes 202 to absorb and removeheat away from the inside of the node and/or from around the componentswithin the node.

As another aspect, the present disclosure provides a modular approach toutilizing air-to-liquid heat exchanger 288 with quick connection and isscalable in both 1 U and 2 U increments. In one or more embodiments, DLcooling subsystem 222 can include a plurality of air-to-liquid (orliquid-to-air) heat exchangers 288 that facilitate the release of someof the heat absorbed by the exhaust liquid to the surrounding atmospherearound the RIHS 100 (of FIG. 1). Air-to-liquid heat exchangers 288 canbe integral to block liquid manifold 289 that, along with the MLDconduits 278 a-278 b, form scalable liquid rail 224. One aspect of thepresent disclosure is directed to providing scalable rack-mountedair-to-liquid heat exchanger 288 for targeted heat rejection ofrack-mounted equipment to DL cooling subsystem 222. Hot air 299 fromauxiliary components, such as storage device 295, would be pushedthrough the air-to-liquid heat exchanger 288, and the resulting energywould transfer to liquid rail 224 and be rejected to a facility coolingloop, represented by the facility return 240.

RIHS 200 can include variations in LC node 202 that still maintainuniformity in interconnections along liquid rail 224 formed by achassis-to-chassis modular interconnect system of MLD conduits 278 a-278b. With this scalability feature accomplished using MLD conduits 278a-278 b, cooling subsystem 222 of the RIHS 200 allows each block chassis210 to be a section of a scalable manifold, referred herein as liquidrail 224, eliminating the need for a rack manifold. The scalability ofliquid rail 224 enables flexible configurations to include variouspermutations of server and switch gear within the same rack (rack 204).MLD conduits 278 a-278 b can comprise standardized hoses with sealable(water tight) end connectors. Thus, the rack liquid flow network canencompass 1 to N IT chassis without impacting rack topology, spaceconstraints, and without requiring unique rack manifolds. Additionally,according to one aspect, the MLD conduits are arranged in a pseudo daisychain modular configuration, which allows for unplugging of one MLDconduit from one rack level without affecting liquid flow to and coolingof other rack levels.

The system of conduits extending from node intake valve 234 into each LCnode 202 enables each LC node 202 to engage to block liquid manifold289. Block chassis 210 or node enclosure 207 of each LC node 102provides the intake and exhaust conduit connections to engage torespective terminals of MLD conduits 278 a-278 b within the MLD networkprovided by liquid rail 224. For example, where nodes 202 are designedas sleds, node enclosure 207 would be a sled tray, and each block wouldthen include more than one sled tray received into block chassis 210,forming the extensions of block liquid manifold 289. Alternatively, thenode enclosure 207 can be a single node chassis such as one of nodes 202c-202 f.

Supply and return bypass tubes 290, 291 of each block liquid manifold289 are connected by MLD conduits 278 a-278 b to form supply railconduit 230 and return rail conduit 238. For clarity, FIG. 2 illustratesthe return rail conduit 238 separately. Liquid rail 224 enables multipletypes of devices to be coupled together, each receiving an appropriatelycontrolled portion of cooling liquid capacity. In one embodiment, liquidcooling subsystem 222 is passively pressurized by attaching MLD supplyconduit 292 a to facility supply 228 and an MLD return conduit 292 b tofacility return 240. Liquid flow from supply rail conduit 230 to returnrail conduit 238 of liquid rail 224 can be controlled based upon factorssuch as a temperature of the liquid coolant, detected temperature withinLC nodes 202, air temperature inside or outside of DL RIHS 200, etc.

In an exemplary embodiment, the scalable rack manifold provided byliquid rail 224 is formed in part by MLD conduits 278 a-278 b that runvertically in the back of the RIHS 200 with quick disconnects on thefront and rear face of block liquid manifold 289 that allows forIT/infrastructure equipment respectively to be plugged into both frontand back sides of the block liquid manifold 289. For example, LC nodes202, such as server modules, can plug into the front side and fanmodules 282 can plug onto the back side of block liquid manifold 289.This also allows for other liquid cooled devices such as LC PowerDistribution Units (PDUs) to be plugged into the cooling liquid supplyrail conduit 230 and return rail conduit 238 of liquid rail 224.Thereby, a rack hot pluggable cooling interface is created for anyrack-mounted equipment.

Cooling subsystem 222 can support an embedded liquid-to-liquid heatexchanger manifold 242, such as in LC node 202 c. Node liquid-to-liquidheat exchangers are provided for rejecting heat from one fluid source toa secondary source. One aspect of the present disclosure solves theproblems that many shared-infrastructure IT systems (e.g., bladechassis) do not have adequate space to accommodate a liquid-to-liquidheat exchanger. Unlike with generally-known systems that rely uponliquid heat transfer having to exchange heat with an externalliquid-to-liquid heat exchanger, the present disclosure enables on-rackliquid-to-liquid heat exchanger that does not require any of thevertical chassis space. Additionally, the present disclosure providesthese benefits without requiring a central distribution unit (CDU),which takes up datacenter floor space. One aspect of the presentdisclosure provides embedded heat exchanger manifold 242 having a commonheat transfer plate and a shared bulk header to create a combined liquiddistribution manifold that includes a secondary liquid coolant forabsorbing heat through the shared bulk header. In particular, thecombined embedded heat exchanger manifold 242 rejects heat within sharednode enclosure 207 such as node 202 c to a secondary liquid coolant.Internal node supply 244 and return conduits 246 of a manifold built ontop of a heat exchanger core allow heat transport within manifold 242.In one embodiment, closed system pump 298 can use a first coolant tocool a high thermal energy generating functional component such as a CPUor voltage regulator.

Additionally, the liquid cooling subsystem 222 also includes afiltration system or unit 271, which prevents chemical impurities andparticulates from clogging or otherwise damaging the conduits as thefluid passes through the network of conduits. According to one aspect ofthe disclosure, liquid cooling subsystem 222 provides RFU 271 in fluidconnection with the intake pipes from facility supply 228. In at leastone embodiment, RFU 271 includes a sequenced arrangement of liquidfilters within a full-sized sled that can be removably inserted by anend user into one of the receiving slots of rack 204. In one embodiment,the RFU 271 is located on an infrastructure sled having rack-levelcontrollers and other rack-level functional components. In at least oneembodiment, the entirety of the sled is filed with components associatedwith RFU 271. Thus, it is appreciated that the RFU 271 may occupy theentire area of one vertical slot/position within the chassis. Alternatelocations of the RFU 271 can also be provided, in different embodiments,with an ideal location presenting the intake port of the RFU 271 inclose proximity to a connection to facility supply 228 to directlyreceive the facility supply 228 prior to the liquid being passed intothe remainder of the conduits of the liquid cooling subsystem 222. It isappreciated that if the system was capable of completing all heatexchange within the rack, then sealing the rack would be feasible andwould reduce and/or remove any requirements for filtration and/orallocation of rack space for RFU 271.

Liquid-cooled compute systems use the high heat transport capacity ofwater. However, the disclosure recognizes and addresses the fact thatwith liquid introduced into an electronic enclosure, there is apotential for leaks that can cause catastrophic system failure. Also, insome instances, a leak can create an electronic short with a resultingexothermal reaction causing permanent damage to the DL RIHS 200. Tomitigate such risks, as one design feature, node-level carrier 293 caninclude a trench/gutter system for use as liquid containment structure294. In one embodiment, the gutter system can also incorporate anabsorbent material that can accumulate sufficient amounts of liquid fromsmall leaks to enable external sensing of the leak. Advantageously, thecarrier 293 can also be thermally conductive to serve as a heat sink forcomponents such as storage devices 295. In one embodiment, another leakdetection solution that can be incorporated into the LC node 202involves use of a solenoid to create an event when additional current isapplied, due to water pooling around the solenoid. Barriers on carrier293 can be specifically designed to contain a liquid leak and assist infunneling the liquid through the gutter system. Liquid rail 224 can alsobe provided with leak containment and detection. In one or moreembodiments, removable pipe covers 276 are sized to be mounted aroundrespective MLD conduits 278 a-278 b and can include liquid sensors 297for automatic alerts and shutdown measures.

In one or more embodiments, DL RIHS 200 further incorporates anode-level liquid containment structure 290 with a cascading drainrunoff tubing network 296 to a rack-level cascading liquid containmentstructure 294. In one or more embodiments, the DL RIHS 200 furtherincorporates leak detection response such as partial or completeautomated emergency shutdown. Liquid sensors (LS) 297 at various cascadelevels can identify affected portions of DL RIHS 200. Containment andautomatic shutoff can address the risks associated with a leakdeveloping in the DL cooling system 222.

RIHS 200 can facilitate maintenance and upgrade activities of certainnodes 202 a-202 c with other nodes continuing to operate. The rack 204has one or more node-receiving slots 205 a-205 c. Each slot 205 a-205 chas a front opening for node insertion and a rear section opposed to thefront access. The node-receiving slots 205 a-205 c are defined withinblock chassis 210. Hot plugging of a node 202 a-202 c can include alarge force if coupling requires displacement of fluid retained in theinternal node supply conduit 244. The fluid may be trapped within thenode 202 a-202 c until valves open. To reduce the force required, anair-spring reducer conduit 203 attached as a dead-end conduit shunt hasa raised arch that traps a bubble of air that compresses in response toa pressure spike. The node 202 d can also be a block in and of itselfand can also benefit from having an air-spring reducer conduit 103.Other components such as the RFU 271 can include a purge capability withactive components that can be triggered to release pressure to allowinsertion.

FIG. 3 illustrates a more detailed view of DL subsystem 320 associatedwith example DL RIHS 300. Within DL RIHS 300, each LC node 302 a, 302 bincludes chassis 310 received in a respective chassis-receiving bay 370of rack 304. Each LC node 302 a, 302 b contains heat-generatingfunctional components 306. Each LC node 302 a, 302 b is configured witha system of internal supply conduit 344 and return conduit 346,associated with embedded heat exchanger manifold 342. Embedded heatexchanger manifold 342 receives direct intake/flow of cooling liquid toregulate the ambient temperature of LC node 302 a, 302 b. A node-leveldynamic control valve 334 and node-level return check valve 336 controlan amount of normal flow and provide shutoff and/or otherwise mitigate aleak. Cooling subsystem 320 provides cooling to heat-generatingfunctional components 306 inside the LC node 302 a, 302 b by removingheat generated by heat-generating functional components 306. Liquid rail324 is formed from more than one node-to-node, MLD conduit 378 betweenmore than one LC node 302 a, 302 b within in rack 304. MLD conduits 378includes first terminal connection 383 and second terminal connection384. First terminal connection 383 and second terminal connection 384are attached on opposite ends of central conduit 385. Central conduit385 is rack-unit dimensioned to directly mate and seal to and enablefluid transfer between a selected pair of rail supply ports 317 and/orrail return ports 319 of a selected LC node 302 a and an adjacent LCnode 302 b.

The cooling subsystem 320 includes block liquid manifolds 389 mountableat a back side of the rack 304. Each block liquid manifold has at leastone rail supply port 317 and at least one rail return port 319 on anoutside facing side of the block liquid manifold 389. The at least onerail supply port 317 and the at least one rail return port 319respectively communicate with at least one block supply port 321 and ablock return port 323 on an inside facing side of the block liquidmanifold 389. LC nodes 302 are insertable in receiving bays 370 of rack304 corresponding to locations of the mounted block liquid manifolds389. Block supply ports 321 and block return ports 323 of the LC nodes302 and an inside facing portion of the corresponding block liquidmanifold 389 are linearly aligned. The linear alignment enables directsealing, for fluid transfer, of the lineally aligned inside manifoldsupply ports 325 and return ports 327 to the inside facing portion ofthe block liquid manifold 389. In one or more embodiments, block supplyport 321 sealed to the internal manifold supply port 325 communicatesvia supply bypass tube 390 to two rail supply ports 317. Block returnport 323 sealed to internal manifold return port 327 communicates viareturn bypass tube 391 of the respective block liquid manifold 389 totwo rail return ports 319. Fan modules 382 mounted respectively ontoback of block liquid manifold 389 have apertures to expose rail supplyand return ports 317, 319. Additionally, fan modules 382 draw hot air399 from LC nodes 302 through an air-liquid heat exchanger 388 in blockliquid manifold 389.

In one or more embodiments, supply liquid conduit 392 a is attached forfluid transfer between facility supply 328 and rail supply port 317 ofblock liquid manifold 389 of RIHS 300. A return liquid conduit 392 b canbe attached for fluid transfer between rail return port 319 of blockliquid manifold 389 to facility return 340. FIG. 3 further illustratesthat the fluid connection to facility supply 328 includes RFU 371. Toprevent contamination or causing damage to cooling subsystem 320, RFU371 is received in bay 370 of rack 304 and includes input port 329connected via supply liquid conduit 392 a to facility supply 328. TheRFU 371 includes output port 331 that is connected to MLD conduit 378 ofsupply rail conduit 330. Liquid rail 324 also includes return railconduit 338. RFU 371 controls two external emergency shutoff valves 333for flow received from the input port 329 that is provided respectivelyvia hot-pluggable disconnects 335 to two replaceable filtration subunits(“filters”) 337. The flow of cooling liquid flows in parallel to tworeplaceable filtration subunits 337, automatically diverting to theother when one is removed for replacing. Thereby, filtration and coolingof RIHS 300 can be continuous. Back-flow is prevented by check valve 339that allows normal flow to exit to output port 331. Differentialpressure sensor 376 measures the pressure drop across filters”) 337 andprovides an electrical signal proportional to the differential pressure.According to one aspect, a Rack Liquid Infrastructure Controller (RLIC)342 can determine that one filter 337 is clogged if the differentialpressure received from differential pressure sensor 376 falls below apre-determined value.

In one or more embodiments, RIHS 300 can provide hot-pluggableserver-level liquid cooling, an integrated leak collection and detectiontrough, and an automatic emergency shut-off circuit. At a block level,RIHS 300 can provide embedded air-to-liquid heat exchange, and dynamicliquid flow control. At a rack level, RIHS 300 can providefacility-direct coolant delivery, a scalable rack fluid network, a rackfiltration unit, and automated rack flow balancing, and a service mode.

According to one embodiment, liquid rail 324 includes a series ofsecondary conduits, such as supply and return divert conduits 397, 398,that provide a by-pass fluid path for each of MLD conduits 378. Inoperation, divert conduit 397 allows for the removal of correspondingMLD conduit 378, thus removing the flow of cooling liquid to theparticular block of nodes, without interrupting the flow of coolingliquid to the other surrounding blocks of computer gear. For example, aparticular MLD conduit 378 can be replaced due to a leak. For anotherexample, a block liquid manifold 389 can be replaced. The inclusion ofdivert conduit 397 thus enables rapid servicing and maintenance of blockliquid manifold 389 and/or nodes within block chassis without having toreconfigure the MLD conduits 378. In addition, the RIHS 300 can continueoperating as cooling liquid continues to be provided to the remainder ofthe blocks that are plugged into the liquid rail. Re-insertion of theMLD conduit 378 then reconnects the flow of cooling liquid to the blockfor normal cooling operations, and shuts off the diverted flow ofcooling liquid.

In one or more embodiments, each LC node 302 can receive liquid coolingservice from a corresponding block liquid manifold 389 as illustrated byFIG. 3. In one or more embodiments, one or more block liquid manifolds328 provide liquid cooling service to a block chassis 310 that in turnquick connects to more than one LC node 302 a, 302 b. A node-receivingliquid inlet port 311 and a node-receiving liquid outlet port 313 arelocated at the rear section of one node-receiving slot 309 a, 309 b andpositioned to be inwardly facing for blind mating to a node inlet andoutlet ports 315, 317 of an LC node 302 a, 302 b inserted in the onenode-receiving slot 309 a, 309 b. The system of internal supply conduit344 and return conduit 346 supply cooling liquid through the nodeenclosure 307. An air-spring reducer conduit 303 is attached for fluidtransfer to the internal supply conduit 344. The supply conduit 344extends from a node inlet coupling 315, which in an exemplary embodimentis a male inlet coupling. The return conduit 346 terminates in a nodeoutlet coupling 317, which in an exemplary embodiment is a male outletcoupling. The node inlet port 315 and the node outlet port 317 arepositioned in an outward facing direction at a rear of the nodeenclosure 307. The node inlet port 315 and the node outlet port 317 arealigned to releasably seal to the respective inlet liquid port andoutlet liquid port in the node-receiving slot 309 a, 309 b, for fluidtransfer through the system of conduits 344, 346. A block supply plenum374 and return plenum 375 can communicate for fluid transfer between theblock liquid manifold 389 and each of the supported LC nodes 302 a, 302b. Modulation or shutoff of cooling liquid at the block level can alsobe incorporated into the block supply plenum 374 and return plenum 375.

FIGS. 4-7 illustrate different exterior and rear views of an exampleassembled DL RIHS 400. DL RIHS 400 includes rack 404, which is aphysical support structure having an exterior frame and attached sidepanels to create cabinet enclosure 464 providing interior chassisreceiving bays (not shown) within which a plurality of individual nodechasses (or sleds) of functional IT nodes, such as LC node 102 of FIG.1, are received. In the description of the figures, similar featuresintroduced in an earlier figure are not necessarily described again inthe description of the later figures. As illustrated, rack 404 includesopposing side panels 466, attached to a top panel 468 (and bottompanel—not shown) to create the main cabinet enclosure 464 that includesmultiple chassis receiving bays for housing LC nodes 102, 202, 302(FIGS. 1-3). The created cabinet enclosure 464 includes a front accessside 465 (FIG. 4) and a rear side. The front access side 465 providesaccess to the chassis receiving bays created within the main cabinetenclosure 464 for receiving LC nodes 102 (of FIG. 1) into rack 404.FIGS. 5-7 illustrate that attached to the rear ends of the main opposingside panels 466 are opposing side panel extensions 572. A louvered reardoor 574 is hinged (or otherwise attached) to one of the side panelextensions 572 and includes a latching mechanism for holding the door574 in a closed position, where in a closed position is relative to theotherwise open space extending laterally between opposing side panelextensions 572. Side panel extensions 572 and louvered rear door 574provide an extension to main cabinet enclosure 464 for housing,covering/protecting, and providing access to the modular, scalableliquid rail 524 of a liquid cooling subsystem 522 that provides liquidcooling to each LC node 102 (of FIG. 1) inserted into the chassis of themain cabinet enclosure 464. Rear pipe covers 576 can protect portions ofliquid rail 524 (of FIG. 5), and specifically Modular LiquidDistribution (MLD) conduits 578, from inadvertent damage as well ascontaining any leaks from being directed at sensitive functionalcomponents 106 (of FIG. 1).

FIG. 8 illustrates example LC node 800 of example DL RIHS 100 of FIG. 1having a node enclosure 807 insertable into a block chassis 810. Forpurposes of description, node 800 is a server IHS that includesprocessing components or central processing units (CPUs), storagedevices, and other components. LC node 800 includes cooling subsystem(generally shown and represented as 820) that includes aliquid-to-liquid manifold 842 to cool heat-generating functionalcomponents 806 by heat transfer from liquid provided by node-levelsupply conduit 844, and return conduit 846, according to one or moreembodiments. Node-level supply conduit 844 and return conduit 846 areappropriately sized and architecturally placed relative to the othercomponents and the dimensionality (i.e., width, height, anddepth/length) of LC node 800 to permit sufficient cooling liquid to passthrough the interior of LC the node 800 to remove the required amount ofheat from LC node 800 in order to provide appropriate operatingconditions (in terms of temperature) for the functional componentslocated within LC node 800. Liquid-to-liquid manifold 842 can includeCPU cold plates 848 and voltage regulator cold plates 850. A sledassembly grab handle 852 can be attached between CPU cold plates 848 forlifting LC node 800 out of block chassis 810. A return-side check valve854 of the return conduit 846 can prevent facility water fromback-feeding into LC node 800 such as during a leak event. Flex hoselinks 856 in each of node-level supply conduit 844 and return conduits846 can reduce insertion force for sleds into block chassis 810. Sledemergency shutoff device 834 interposed in the supply conduit 844 can bea solenoid valve that closes in response to input from a hardwarecircuit during a sled-level leak detection event. Node-level carrier 858received in node enclosure 807 can incorporate liquid containmentstructure 860 to protect storage device 862. In the illustrative exampleillustrated by FIG. 8, LC node 800 is oriented horizontally and isviewed from above. In one or more embodiments node-level carrier 858 isconfigured to route leaked cooling liquid away from storage device 862when oriented vertically. The node-level return conduit 846 of theexample LC node 802 includes P-trap air-spring reducer conduit 803.

FIGS. 9-11 illustrate a system of conduits of the node-level supplyconduit 944 and the node-level return conduit 846 of the example LC node802 (FIG. 8) including a P-trap air-spring reducer conduit 803. FIGS.12-13 illustrate the dog-leg shape of the P-trap air-spring reducerconduit 803. FIG. 14 illustrates an example air-spring reducer conduit1403 having an arched, hooked shape.

FIG. 15 illustrates a method 1500 of assembling a DL RIHS thatfacilitates hot plugging of LC nodes. In one or more embodiments, themethod 1500 includes provisioning a node enclosure with heat-generatingfunctional components (block 1502). The method 1500 includes assemblingwith a system of conduits in fluid communication an air-spring reducerconduit that is shaped to trap an amount of compressible fluid (block1504). In one embodiment, the air-spring reducer conduit is a P-traphaving an arch shape. In one embodiment, the air-spring reducer conduitis hook shaped. In one embodiment, the air-spring reducer conduit isdog-leg shaped.

In one or more embodiments, the method 1500 can include attaching aliquid manifold in thermally-conductive contact with at least oneheat-generating functional component within the node enclosure (block1506). The method 1500 includes attaching the system of conduitssupplying cooling liquid through the node enclosure and including asupply conduit extending from the node inlet coupling and a returnconduit terminating in the node outlet coupling (block 1508). The nodeinlet port and the node outlet port are positioned in an outward facingdirection at a rear of the node enclosure. The node inlet port and thenode outlet port are aligned to releasably seal to the respective inletliquid port and outlet liquid port in the node-receiving slot, for fluidtransfer through the system of conduits to form a LC node. In one ormore embodiments, the node inlet and outlet ports can be male quickconnect couplings and the node-receiving inlet and the outlet ports canbe corresponding female quick connect couplings that engagably seal forfluid transfer and automatically shutoff fluid leak in response todisengagement.

In one or more embodiments, the method 1500 can include mounting a blockliquid manifold received in a rear section of the rack aligned with aselected block chassis-receiving bay in the rack having at least oneblock chassis-receiving bay (block 1510). The method 1500 can includemounting a block chassis received in the selected blockchassis-receiving bay of the rack to sealingly engage the block liquidmanifold to receive cooling liquid and to return cooling liquid that hasabsorbed heat from the LC node (block 1512). The block chassis caninclude one or more node-receiving slots. Each slot has a front openingfor node insertion and a rear section opposed to the front access forblind mating of the node inlet and outlet ports to a node-receivingliquid inlet port and a node-receiving liquid outlet port.

The method 1500 includes mounting the LC node insertably received in aselected node-receiving slot of the rack having one or morenode-receiving slots with insertion force mitigated by compressiblefluid such as air in the air-spring reducer conduit (block 1514). Theair compresses during sealing engagement between a node inlet couplingand a node outlet coupling and an inlet liquid port and an outlet liquidport, respectively. The latter are located at the rear section of onenode-receiving slot and positioned to be inwardly facing to the LC nodeinserted in the one node-receiving slot.

In the above described flow charts of FIG. 15, one or more of themethods may be embodied in an automated manufacturing system thatperforms a series of functional processes. In some implementations,certain steps of the methods are combined, performed simultaneously orin a different order, or perhaps omitted, without deviating from thescope of the disclosure. Thus, while the method blocks are described andillustrated in a particular sequence, use of a specific sequence offunctional processes represented by the blocks is not meant to imply anylimitations on the disclosure. Changes may be made with regards to thesequence of processes without departing from the scope of the presentdisclosure. Use of a particular sequence is therefore, not to be takenin a limiting sense, and the scope of the present disclosure is definedonly by the appended claims.

One or more of the embodiments of the disclosure described can beimplementable, at least in part, using a software-controlledprogrammable processing device, such as a microprocessor, digital signalprocessor or other processing device, data processing apparatus orsystem. Thus, it is appreciated that a computer program for configuringa programmable device, apparatus or system to implement the foregoingdescribed methods is envisaged as an aspect of the present disclosure.The computer program may be embodied as source code or undergocompilation for implementation on a processing device, apparatus, orsystem. Suitably, the computer program is stored on a carrier device inmachine or device readable form, for example in solid-state memory,magnetic memory such as disk or tape, optically or magneto-opticallyreadable memory such as compact disk or digital versatile disk, flashmemory, etc. The processing device, apparatus or system utilizes theprogram or a part thereof to configure the processing device, apparatus,or system for operation.

While the disclosure has been described with reference to exemplaryembodiments, it will be understood by those skilled in the art thatvarious changes may be made and equivalents may be substituted forelements thereof without departing from the scope of the disclosure. Inaddition, many modifications may be made to adapt a particular system,device or component thereof to the teachings of the disclosure withoutdeparting from the essential scope thereof. Therefore, it is intendedthat the disclosure not be limited to the particular embodimentsdisclosed for carrying out this disclosure, but that the disclosure willinclude all embodiments falling within the scope of the appended claims.Moreover, the use of the terms first, second, etc. do not denote anyorder or importance, but rather the terms first, second, etc. are usedto distinguish one element from another.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the disclosure.As used herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

The description of the present disclosure has been presented forpurposes of illustration and description, but is not intended to beexhaustive or limited to the disclosure in the form disclosed. Manymodifications and variations will be apparent to those of ordinary skillin the art without departing from the scope of the disclosure. Thedescribed embodiments were chosen and described in order to best explainthe principles of the disclosure and the practical application, and toenable others of ordinary skill in the art to understand the disclosurefor various embodiments with various modifications as are suited to theparticular use contemplated.

What is claimed is:
 1. A Rack Information Handling System (RIHS)comprising: a rack having one or more node-receiving slots each slothaving a front opening for node insertion and a rear section opposed tothe front access; a node-receiving liquid inlet port and anode-receiving liquid outlet port located at the rear section of onenode-receiving slot and positioned to be inwardly facing for blindmating to a node inlet and outlet ports of a liquid-cooled (LC) nodeinserted in the one node-receiving slot; an LC node insertably receivedin the one node-receiving slot and comprising an air-spring reducerconduit in fluid communication with a system of conduits supplyingcooling liquid through a node enclosure, the air-spring reducer shapedto trap an amount of compressible fluid that compresses during sealingengagement between the node inlet coupling and node outlet coupling andthe inlet liquid port and outlet liquid port, respectively.
 2. The RIHSof claim 1, wherein the system of conduits further comprises a liquidmanifold in thermally-conductive contact with at least oneheat-generating functional component within the node enclosure.
 3. TheRIHS of claim 1, wherein: the system of conduits comprises a supplyconduit extending from a node inlet coupling and a return conduitterminating in a node outlet coupling, the node inlet port and the nodeoutlet port positioned in an outward facing direction at a rear of thenode enclosure and aligned to releasably seal to the respective inletliquid port and outlet liquid port in the node-receiving slot, for fluidtransfer through the system of conduits; the node inlet and outlet portscomprise male quick connect couplings and the node-receiving inlet andoutlet ports comprise corresponding female quick connect couplings thatengageably seal for fluid transfer and automatically shut off fluid leakin response to disengagement.
 4. The RIHS of claim 1, wherein theair-spring reducer conduit comprises a P trap having an arch that trapsthe amount of compressive fluid.
 5. The RIHS of claim 4, wherein theair-spring reducer conduit comprises first and second conduit segmentsattached at an oblique angle to each other.
 6. The RIHS of claim 4,wherein the air-spring reducer conduit has a hooked shape.
 7. The RIHSof claim 1, wherein: the rack has at least one block chassis-receivingbay; a block liquid manifold is received in a rear section of the rackaligned with a selected block chassis-receiving bay; and a block chassisreceived in the selected block chassis-receiving bay of the rack toreceive cooling liquid and to return cooling liquid that has absorbedheat from the LC node, comprising the one or more node-receiving slots,sealing engaged to the block liquid manifold.
 8. A liquid cooled (LC)node of a Rack Information Handling System (RIHS) including a rackhaving one or more node-receiving slots each slot having a front openingfor node insertion and a rear section opposed to the front access, thenode comprising: an air-spring reducer conduit in fluid communicationwith a system of conduits supplying cooling liquid through the nodeenclosure, the air-spring reducer conduit shaped to trap an amount ofcompressible fluid that compresses during sealing engagement between anode inlet coupling and node outlet coupling and an inlet liquid portand outlet liquid port, respectively, positioned to be inwardly facingfor blind mating to a node inlet and outlet ports of a liquid-cooled(LC) node inserted in the one node-receiving slot.
 9. The LC node ofclaim 8, wherein the system of conduits further comprises a liquidmanifold in thermally-conductive contact with at least oneheat-generating functional component within the node enclosure.
 10. TheLC node of claim 8, wherein: the system of conduits comprise a supplyconduit extending from a node inlet coupling and a return conduitterminating in a node outlet coupling, the node inlet port and the nodeoutlet port positioned in an outward facing direction at a rear of thenode enclosure and aligned to releasably seal to respective inlet liquidport and outlet liquid port in the node-receiving slot for fluidtransfer through the system of conduits; and the node inlet and outletports comprise male quick connect couplings and the node-receiving inletand the outlet ports comprise corresponding female quick connectcouplings that engageably seal for fluid transfer and automaticallyshutoff fluid leak in response to disengagement.
 11. The LC node ofclaim 8, wherein the air-spring reducer conduit comprises a P trapconnected to a liquid manifold in thermally-conductive contact with atleast one heat-generating functional component within the nodeenclosure, the P trap having an arch that traps the amount ofcompressive fluid.
 12. The LC node of claim 11, wherein the air-springreducer conduit comprises first and second conduit segments attached atan oblique angle to each other.
 13. The LC node of claim 11, wherein theair-spring reducer conduit has a hooked shape.
 14. The LC node of claim1, wherein: the rack has at least one block chassis-receiving bay; ablock liquid manifold is received in a rear section of the rack alignedwith a selected block chassis-receiving bay; and a block chassisreceived in the selected block chassis-receiving bay of the rack toreceive cooling liquid and to return cooling liquid that has absorbedheat from the LC node, comprising the one or more node-receiving slots,sealing engaged to the block liquid manifold.
 15. A method of assemblinga Rack Information Handling System (RIHS), the method comprising:provisioning a node enclosure with heat-generating functionalcomponents; assembling a system of conduits in fluid communication withan air-spring reducer conduit that is shaped to trap an amount ofcompressible fluid that compresses during sealing engagement between anode inlet coupling and a node outlet coupling and an inlet liquid portand an outlet liquid port, respectively; and mounting the LC nodeinsertably received in the one node-receiving slot of a rack having oneor more node-receiving slots each slot having a front opening for nodeinsertion and a rear section opposed to the front access for blindmating of the node inlet and outlet ports to a node-receiving liquidinlet port and a node-receiving liquid outlet port located at the rearsection of one node-receiving slot and positioned to be inwardly facingto the LC node inserted in the one node-receiving slot.
 16. The methodof claim 15, wherein assembling the system of conduits further comprisesattaching a liquid manifold in thermally-conductive contact with atleast one heat-generating functional component within the nodeenclosure.
 17. The method of claim 15, further comprising: attaching thesystem of conduits supplying cooling liquid through the node enclosureand including a supply conduit extending from the node inlet couplingand a return conduit terminating in the node outlet coupling, the nodeinlet port and the node outlet port positioned in an outward facingdirection at a rear of the node enclosure and aligned to releasably sealto the respective inlet liquid port and outlet liquid port in thenode-receiving slot, for fluid transfer through the system of conduitsto form a liquid-cooled (LC) node; wherein the node inlet and outletports comprise male quick connect couplings and the node-receiving inletand the outlet ports comprise corresponding female quick connectcouplings that engageably seal for fluid transfer and automaticallyshutoff fluid leak in response to disengagement.
 18. The method of claim15, wherein the air-spring reducer conduit comprises a P trap connectedto a liquid manifold in thermally-conductive contact with at least oneheat-generating functional component within the node enclosure, the Ptrap having an arch that traps the amount of compressive fluid.
 19. Themethod of claim 18, wherein the air-spring reducer conduit comprises aselected one of a hooked shape and a dog-leg shape having a first andsecond conduit segments attached at an oblique angle to each other. 20.The method of claim 15, further comprising: mounting a block liquidmanifold received in a rear section of the rack aligned with a selectedblock chassis-receiving bay in the rack having at least one blockchassis-receiving bay; and mounting a block chassis received in theselected block chassis-receiving bay of the rack to receive coolingliquid and to return cooling liquid that has absorbed heat from the LCnode, wherein the block chassis comprises the one or more node-receivingslots, wherein the block chassis sealingly engages to the block liquidmanifold.